THERMAL CYCLING: Temperature cycling is utilized to verify that flight hardware meets both environmental temperature extremes and operational temperature ranges. A typical component screening requirement specifies that cycles utilize extremes between –65°C and +150°C. Temperature cycling is also used to assure that components are resistant to degradation and failure as a result of temperature exposure. Such damage may include cracking and delamination of finishes, internal component cracking, opening of thermal or hermetic seals and/or seams, and changes in electrical characteristics due to mechanical displacement or rupture of internal parts.